Engineering Blog

Insights & Tutorials

Practical engineering knowledge from the Ohmframe team. Thermal design, packaging, simulation, and manufacturing insights.

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DFM Guidelines for Sheet Metal Enclosures
OF
Manufacturing

DFM Guidelines for Sheet Metal Enclosures

Avoid costly manufacturing mistakes with these design-for-manufacturing rules for power electronics enclosures.

7 min read
2025-11-28
Liquid Cooling vs Air Cooling: When to Make the Switch
OF
Thermal Design

Liquid Cooling vs Air Cooling: When to Make the Switch

Understand the trade-offs between liquid and air cooling for high-power applications and when each makes sense.

7 min read
2025-11-20
CFD Simulation for Power Electronics: A Practical Guide
OF
Simulation

CFD Simulation for Power Electronics: A Practical Guide

How to use CFD simulation effectively in your thermal design process, from model setup to results interpretation.

8 min read
2025-11-15
IP Ratings Explained: Designing Outdoor Power Electronics Enclosures
OF
Packaging

IP Ratings Explained: Designing Outdoor Power Electronics Enclosures

Everything you need to know about IP ratings and how to design enclosures that meet IP65, IP66, and IP67 requirements.

9 min read
2025-11-10
Liquid Cooling for AI Infrastructure: From Rack to Chip
OF
Datacenter

Liquid Cooling for AI Infrastructure: From Rack to Chip

Direct-to-chip liquid cooling is becoming essential for AI workloads. We break down the architectures and implementation challenges.

8 min read
2025-12-12
1000W Per Chip: Thermal Challenges of Next-Gen AI Accelerators
OF
Datacenter

1000W Per Chip: Thermal Challenges of Next-Gen AI Accelerators

NVIDIA Blackwell and AMD MI300X are pushing thermal limits. How do you cool a chip that dissipates a kilowatt?

8 min read
2025-12-08
Designing PDUs for Hyperscale AI Datacenters
OF
Datacenter

Designing PDUs for Hyperscale AI Datacenters

Power distribution for 100kW+ racks requires rethinking everything from bus bars to thermal management.

9 min read
2025-12-01
How to Design an IP65/IP67 Enclosure for Outdoor Electronics
OF
How-To Guide

How to Design an IP65/IP67 Enclosure for Outdoor Electronics

Learn gasket selection, sealing strategies, and common mistakes when designing weather-resistant electronic enclosures.

7 min read
2025-12-17
How to Select the Right Thermal Interface Material (TIM)
OF
How-To Guide

How to Select the Right Thermal Interface Material (TIM)

Thermal grease vs thermal pad vs phase-change material: which TIM is best for your power electronics application?

8 min read
2025-12-15
How to Reduce Junction Temperature in MOSFETs and IGBTs
OF
How-To Guide

How to Reduce Junction Temperature in MOSFETs and IGBTs

Practical techniques for lowering Tj in power semiconductors: thermal design, derating, and layout optimization.

7 min read
2025-12-14
Heat Pipes vs Vapor Chambers: Which Is Better for Your Design?
OF
Comparison

Heat Pipes vs Vapor Chambers: Which Is Better for Your Design?

Compare heat spreading performance, cost, and application suitability for heat pipes and vapor chambers.

9 min read
2025-12-12
Extruded vs Bonded Fin vs Skived Heat Sinks: Cost and Performance Comparison
OF
Comparison

Extruded vs Bonded Fin vs Skived Heat Sinks: Cost and Performance Comparison

Choosing the right heat sink manufacturing method for your power level, quantity, and budget.

8 min read
2025-12-11
Cold Plates vs Heat Sinks: When to Use Each in Power Electronics
OF
Comparison

Cold Plates vs Heat Sinks: When to Use Each in Power Electronics

Decision framework for choosing between passive heat sinks and active liquid-cooled cold plates.

8 min read
2025-12-10
How to Design a Cold Plate for Liquid Cooling Systems
OF
How-To Guide

How to Design a Cold Plate for Liquid Cooling Systems

Channel geometry, flow rate calculations, pressure drop optimization, and manufacturing considerations for cold plates.

7 min read
2025-12-09
How to Calculate Thermal Resistance: Junction to Ambient
OF
How-To Guide

How to Calculate Thermal Resistance: Junction to Ambient

Step-by-step thermal resistance network analysis from chip junction through TIM, heat sink, to ambient air.

5 min read
2025-12-08
How to Prevent Thermal Runaway in Battery Pack Design
OF
How-To Guide

How to Prevent Thermal Runaway in Battery Pack Design

Cell spacing, thermal barriers, cooling strategies, and BMS integration for safe battery thermal management.

5 min read
2025-12-07
Aluminum vs Copper Heat Sinks: When Copper Is Worth the Cost
OF
Comparison

Aluminum vs Copper Heat Sinks: When Copper Is Worth the Cost

Thermal conductivity, weight, cost, and manufacturing differences between aluminum and copper heat sinks.

7 min read
2025-12-06
Natural Convection vs Forced Air Cooling: Design Trade-offs
OF
Comparison

Natural Convection vs Forced Air Cooling: Design Trade-offs

When can you skip the fan? Understanding natural convection limits and fan-cooled system design.

9 min read
2025-12-05
How to Optimize PCB Thermal Design for Power Electronics
OF
How-To Guide

How to Optimize PCB Thermal Design for Power Electronics

Copper pours, thermal vias, component placement, and layer stackup strategies for effective PCB heat dissipation.

5 min read
2025-12-04