Insights & Tutorials
Practical engineering knowledge from the Ohmframe team. Thermal design, packaging, simulation, and manufacturing insights.
Featured Articles

Thermal Design Best Practices for EV Chargers
Learn the key thermal considerations when designing DC fast chargers, from component placement to cooling system selection.

How to Choose the Right Thermal Interface Material
A practical guide to selecting TIMs for power electronics, covering thermal greases, pads, and phase-change materials.

The Gen AI Cooling Crisis: How Hyperscalers Are Rethinking Thermal Design
With AI GPU clusters pushing 700W+ per chip, traditional datacenter cooling is hitting its limits. Here's what's changing.

How to Size a Heat Sink for Power Electronics: Step-by-Step Guide
Complete guide to calculating heat sink thermal resistance, selecting fin geometry, and validating designs with simulation.

How to Pass EMI/EMC Testing on the First Attempt
Pre-compliance testing, shielding design, and filter placement strategies to avoid costly re-tests.

Air Cooling vs Liquid Cooling for Power Electronics: Complete Comparison
When should you switch from air to liquid cooling? Cost, complexity, and performance trade-offs explained.
All Articles

DFM Guidelines for Sheet Metal Enclosures
Avoid costly manufacturing mistakes with these design-for-manufacturing rules for power electronics enclosures.

Liquid Cooling vs Air Cooling: When to Make the Switch
Understand the trade-offs between liquid and air cooling for high-power applications and when each makes sense.

CFD Simulation for Power Electronics: A Practical Guide
How to use CFD simulation effectively in your thermal design process, from model setup to results interpretation.

IP Ratings Explained: Designing Outdoor Power Electronics Enclosures
Everything you need to know about IP ratings and how to design enclosures that meet IP65, IP66, and IP67 requirements.

Liquid Cooling for AI Infrastructure: From Rack to Chip
Direct-to-chip liquid cooling is becoming essential for AI workloads. We break down the architectures and implementation challenges.

1000W Per Chip: Thermal Challenges of Next-Gen AI Accelerators
NVIDIA Blackwell and AMD MI300X are pushing thermal limits. How do you cool a chip that dissipates a kilowatt?

Designing PDUs for Hyperscale AI Datacenters
Power distribution for 100kW+ racks requires rethinking everything from bus bars to thermal management.

How to Design an IP65/IP67 Enclosure for Outdoor Electronics
Learn gasket selection, sealing strategies, and common mistakes when designing weather-resistant electronic enclosures.

How to Select the Right Thermal Interface Material (TIM)
Thermal grease vs thermal pad vs phase-change material: which TIM is best for your power electronics application?

How to Reduce Junction Temperature in MOSFETs and IGBTs
Practical techniques for lowering Tj in power semiconductors: thermal design, derating, and layout optimization.

Heat Pipes vs Vapor Chambers: Which Is Better for Your Design?
Compare heat spreading performance, cost, and application suitability for heat pipes and vapor chambers.

Extruded vs Bonded Fin vs Skived Heat Sinks: Cost and Performance Comparison
Choosing the right heat sink manufacturing method for your power level, quantity, and budget.

Cold Plates vs Heat Sinks: When to Use Each in Power Electronics
Decision framework for choosing between passive heat sinks and active liquid-cooled cold plates.

How to Design a Cold Plate for Liquid Cooling Systems
Channel geometry, flow rate calculations, pressure drop optimization, and manufacturing considerations for cold plates.

How to Calculate Thermal Resistance: Junction to Ambient
Step-by-step thermal resistance network analysis from chip junction through TIM, heat sink, to ambient air.

How to Prevent Thermal Runaway in Battery Pack Design
Cell spacing, thermal barriers, cooling strategies, and BMS integration for safe battery thermal management.

Aluminum vs Copper Heat Sinks: When Copper Is Worth the Cost
Thermal conductivity, weight, cost, and manufacturing differences between aluminum and copper heat sinks.

Natural Convection vs Forced Air Cooling: Design Trade-offs
When can you skip the fan? Understanding natural convection limits and fan-cooled system design.

How to Optimize PCB Thermal Design for Power Electronics
Copper pours, thermal vias, component placement, and layer stackup strategies for effective PCB heat dissipation.