Common Challenges
1
High-frequency magnetic component cooling
2
Medium-voltage isolation and clearances
3
Thermal management of SiC/GaN devices
4
Compact modular enclosure design
5
Grid code compliance requirements
Our Solutions
Integrated cooling for magnetic components
High-voltage enclosure design with proper creepage
Advanced TIM selection for wide-bandgap devices
Modular rack-mount enclosure systems
Services for Solid-State Transformers
Specialized engineering services tailored to solid-state transformers applications
Thermal Management
CFD simulation, heat sink design, liquid cooling systems, and thermal interface materials
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EMI/EMC Compliance
Shielding design, filter design, grounding strategies, and pre-compliance testing support
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Mechanical Design
Enclosure design, IP-rated housings, structural analysis, and rugged packaging
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