Common Challenges
1
Increasing rack power densities (100kW+)
2
High availability requirements (99.999%)
3
Hot-swappable module design
4
Liquid cooling integration
5
Acoustic noise constraints
Our Solutions
Rear-door heat exchanger integration
Redundant cooling path design
Hot-swap bus bar and connector design
Direct-to-chip liquid cooling systems
Services for Datacenter Power
Specialized engineering services tailored to datacenter power applications
Thermal Management
CFD simulation, heat sink design, liquid cooling systems, and thermal interface materials
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EMI/EMC Compliance
Shielding design, filter design, grounding strategies, and pre-compliance testing support
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Mechanical Design
Enclosure design, IP-rated housings, structural analysis, and rugged packaging
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